Nanotechnology enables new opportunities for the
hundred-billion-dollar integrated circuit (IC) industry to advance
development of electronic products. The modeling and simulation of new
nanoscale devices and interconnects will setup the foundation of future
large integration of nanoscale components in ICs. This talk focuses on the
simulation and modeling development of the two most promising candidates:
carbon-based interconnect and junction-based nanodevice. The application
of these devices/interconnects to 2D/3D ICs and reconfigurable ICs is
discussed. Furthermore, the state-of-art R&D research activities on other
IC industry-related nanostructures and materials in US are also
summarized.